2020年5月24日星期日

Commonly Used Inverter Temperature Detection Circuit

Here is a Rigid Pcb Supplier talking about Commonly used inverter temperature detection circuit.
If you have any idea about Buried PCB Board, welcome to contact us and discuss.
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The temperature detection circuit of common IGBT modules is mostly caused by the internal or external temperature sensor of the module (mostly a negative temperature coefficient thermistor), and a voltage divider circuit of +5V is formed in series with the resistor, thereby converting the temperature change signal into a voltage signal. Directly or after being processed by a voltage follower, it is sent to the MCU pin. The detection signal is an analog voltage signal.
The module temperature detection circuit of the low-power inverter is composed of a temperature sensor and a 555 time-base circuit to form a multi-stable (also called multi-vibrator) circuit. The low-level width of the 3-pin output pulse represents a temperature signal. The temperature detection signal is obtained by D-A conversion of the subsequent stage circuit (MCU).

C37, C38 charging time is determined by R2, D32, the time constant is small, corresponding to the high-level width of the 3-pin output pulse; the discharge time of C37, C38 is determined by the parallel value of RT, R3, the time constant is large, corresponding to 3 The low-level width of the pin output pulse.

Commonly Used Inverter Temperature Detection Circuit

Here is a Rigid Pcb Supplier talking about Commonly used inverter temperature detection circuit.
If you have any idea about Buried PCB Board, welcome to contact us and discuss.
Rigid Pcb Supplier
The temperature detection circuit of common IGBT modules is mostly caused by the internal or external temperature sensor of the module (mostly a negative temperature coefficient thermistor), and a voltage divider circuit of +5V is formed in series with the resistor, thereby converting the temperature change signal into a voltage signal. Directly or after being processed by a voltage follower, it is sent to the MCU pin. The detection signal is an analog voltage signal.
The module temperature detection circuit of the low-power inverter is composed of a temperature sensor and a 555 time-base circuit to form a multi-stable (also called multi-vibrator) circuit. The low-level width of the 3-pin output pulse represents a temperature signal. The temperature detection signal is obtained by D-A conversion of the subsequent stage circuit (MCU).

C37, C38 charging time is determined by R2, D32, the time constant is small, corresponding to the high-level width of the 3-pin output pulse; the discharge time of C37, C38 is determined by the parallel value of RT, R3, the time constant is large, corresponding to 3 The low-level width of the pin output pulse.

2020年5月18日星期一

Commonly Used Inverter Temperature Detection Circuit

Here is Rigid Pcb Manufacturer talking about Commonly used inverter temperature detection circuit. 
If you have any idea about Embedded Active Components Pcb, welcome to contact us and discuss.
The temperature detection circuit of common IGBT modules is mostly caused by the internal or external temperature sensor of the module (mostly a negative temperature coefficient thermistor), and a voltage divider circuit of +5V is formed in series with the resistor, thereby converting the temperature change signal into a voltage signal. Directly or after being processed by a voltage follower, it is sent to the MCU pin. The detection signal is an analog voltage signal.
Rigid Pcb Manufacturer
The module temperature detection circuit of the low-power inverter is composed of a temperature sensor and a 555 time-base circuit to form a multi-stable (also called multi-vibrator) circuit. The low-level width of the 3-pin output pulse represents a temperature signal. The temperature detection signal is obtained by D-A conversion of the subsequent stage circuit (MCU).

C37, C38 charging time is determined by R2, D32, the time constant is small, corresponding to the high-level width of the 3-pin output pulse; the discharge time of C37, C38 is determined by the parallel value of RT, R3, the time constant is large, corresponding to 3 The low-level width of the pin output pulse.

2020年5月12日星期二

Pcb Industry Has Become The Key To The Development Of The National Economy

Here is High Frequency Pcb Factory talking about PCB industry has become the key to the development of the national economy. 
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Over the past decade, global PCBs have continued to migrate to Asia, especially China, and mainland China has quickly become a major electronics and PCB producer. China's domestic market potential and manufacturing advantages have attracted foreign investment, prompting China's PCB industry to grow in multiples in just a few years.
At present, China's PCB industry has the following four brief features in addition to its output value and sales in the electronic component manufacturing industry:
High Frequency Pcb Factory
1. Product use and market expansion: PCB is a key interconnect of electronic equipment, and any electronic equipment needs to be equipped. Especially in the current electronic information, data processing and communication equipment put higher standards and more requirements on the PCB.
2. Expansion of the industry: The printed circuit industry has evolved from a single board processing to electronic circuit components, including the assembly of electronic circuit components and the development of electronic manufacturing services (EMS). Printed board manufacturers will perform electronic assembly services according to customer requirements.
3. Product grades continue to improve: At present, ordinary PCBs are still suitable for general electronic equipment, and a new generation of electronic equipment requires higher density circuit boards, which is suitable for multi-function, miniaturization and lightweight requirements of the whole machine. Mainly to develop multi-layer boards, flexible boards, and high-density interconnect (HDI/BUM) substrates and IC package (BGA, CSP) substrates.
4. Further improvement of production technology: In order to process high-density circuit boards, new process technologies are needed in graphics production, hole processing, surface coating, and inspection. Blind/buried holes and laminated methods are common applications. The development of new materials for HDI/BUM boards and IC package substrates, and better performance in electrical and mechanical aspects will introduce a large number of new laser and optoelectronic automation equipment.
In 2013, China's PCB production value reached 22.559 billion US dollars, accounting for 41.1% of the global PCB production value.
China's printed circuit board industry also presents a decentralized competitive landscape. The size of enterprises is generally small, and the number of large PCB companies is small. According to CPCA statistics, there were about 1,500 PCB companies in China in 2013, mainly distributed in the Pearl River Delta, the Yangtze River Delta, and the Bohai Rim region. In 2013, a total of 50 large enterprises and super-large enterprises accounted for 3.3% of the total number of PCB companies in mainland China.

2020年5月6日星期三

How To Identify True And False Chips?

Here is Rigid Pcb Manufacturer talking about How To Identify True And False Chips. 
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The complete process of chip fabrication includes chip design, wafer fabrication, package fabrication, and testing. The wafer fabrication process is particularly complicated. China is the world's largest importer of e-waste. Every year, 70% of the world's e-waste is shipped to China. The source of e-waste is mostly developed countries such as Europe, America, and Japan. These e-wastes are expensive to handle in their home countries. After arriving in China, transfer to various places for dismantling.
In Huaqiang North, the largest distribution center for electronic components in Asia, many businesses mainly operate renovation and dismantling parts. The source of these disassembled parts and refurbished parts are the dismantlings of e-waste. The low-cost electronic waste is dismantled, and the available electronic components are refurbished and returned to the component market to earn huge price differences, resulting in the proliferation of counterfeit and refurbished electronic components. 
Rigid Pcb Manufacturer
So, how do we identify true and false chips when we buy?
1. See if the surface of the chip has polished marks
Any surface of the polished chip will have fine lines or even micro marks on the previous print. Some cover the surface of the chip with a thin coating, which looks a bit shiny and has no plastic texture.
2. See the printing
Most of the current chips are laser-marked or printed on a dedicated chip printer. The writing is clear, unobtrusive, unobtrusive and difficult to erase. Refurbished chips are either "saw-toothed" by the edges of the writing tape and are "saw-toothed", or they are illegible, inconsistent, misplaced, easily erasable or too conspicuous.
In addition, the screen printing process of the current IC manufacturers have long been eliminated, but many chip refurbishment due to cost reasons still use the silkscreen process, which is also one of the judgment basis, the screen printing word will be slightly higher than the chip surface, you can feel the slight unevenness by hand touch Or have a feeling of worry.
However, it should be noted that due to the recent sharp decline in the price of small laser marking machines, more and more refurbished ICs use laser marking, and some new films will use this method to change the wordmark or simply replay to "improve" the chip. The grade, this requires special attention, and the method of distinguishing is more difficult, you need to practice the "eyes of fire."
The main method is to look at the overall coordination, the writing and the background, the new and old degree of the pin does not match, such as the word mark is too new, too clear the possibility of problems, but many small factories, especially some small IC companies in China The chip was born like this, which adds a lot of trouble to the identification, but the judgment of the mainstream big chip is still very meaningful.
In addition, more and more laser marking machines have been used to modify chip markings. Especially in memory and some high-end chips, once the location of laser printing is found to be inconsistent in individual letters and strokes, it can be considered false. goods.
3. Look at the pin
All the tin-plated pins that are as bright as “new” must be refurbished. The majority of the pins of the IC should be the so-called “silver powder feet”. The color is darker but the color is uniform. There should be no traces of oxidation or “flux” on the surface. ", DIP and other plug-in pins should not have traces of wiping, even if there is (repackage will be) scratches should be neat, in the same direction and the metal exposed is smooth and non-oxidized.
4. See the device production date and package factory label
The label of the genuine goods, including the label on the bottom surface of the chip, should be consistent and the production time should be consistent with the product. Although the counterfeit chips have the same frontal label, sometimes the values are unreasonable (such as what the "Geely number" is marked) or the production date does not match the device. If the label on the bottom of the device is confusing, the device is a fake.
5. Measure the thickness of the device and look at the edge of the device
Many original laser-printed refurbished refurbished pieces (mostly power devices) must be ground deeper because of the need to remove the original mark, so the overall thickness of the device will be significantly smaller than the normal size, but not compared or measured with a caliper, the general inexperienced person still It's hard to tell, but there is a general knowledge of breaking the law, that is, looking at the front edge of the device. Because the plastic sealing device must be “released” after injection molding, the edge angle of the device is round (R angle), but the size is not large. It is easy to grind the rounded corner at right angle during the grinding process, so the front edge of the device is right angled. Can be judged as grinding goods.
 In addition, there is another method to see if the merchant has a large number of original packaging materials, including the inside and outside of the uniform carton, anti-static plastic bags, etc., the actual identification should be used in multiple ways, there is a problem can be identified The quality of the device.

2020年4月30日星期四

Design Principles Of High-Speed PCB

What is high speed? This is the basis for considering the high speed problem, and is also a problem among many hardware engineers. With the development of the times, electronic design engineers have slowly reached a consensus.

The edge rate of the signal is the key to determine the high-speed problem. When the signal's rise time and transmission delay can be compared, it is a high-speed circuit. Although there are various circuits on the PCB, there are always some general principles that can be observed for the design. Rigid PCB Manufacturersto explain.

1. Impedance matching principle
Impedance mismatch is the root cause of many high-speed problems caused by reflections. Conventionally, a high-speed problem cannot be discussed without an impedance match. From this design original. The following high-speed PCB board design requirements are derived:
(1) A reasonable layout for termination matching design. In PCB layout, first determine the position of electronic components on the PCB, then design the power line, ground line and high-speed signal line
After the design of ordinary signal lines.
(2) Less through holes, which will cause important impedance discontinuity.
(3) The stacking setting is reasonable to ensure that the impedance is consistent after the signal is changed, while taking into account the performance and price.
(4) Pay attention to the corners of the trace. 900 and acute angles will cause impedance discontinuities.
(5) The line width is equal, and the line width can be partially reduced in the range of BGA (PCB with ball grid array structure) and high-speed connectors. These areas are also impedance discontinuities.
(6) Differential wiring is equally spaced to control differential impedance.
(7) Pay attention to the signal cross-segmentation. In addition to the problem of backflow, the position of the cross-segmentation is also a point of impedance discontinuity.

High Speed PCB
High Speed PCB
2. Principle of suppressing interference
Interference includes the mutual interference of wiring and components inside the board, as well as the interference of the external electromagnetic environment.
(1) Route 3W principle to ensure line spacing.
(2) The 20H criterion suppresses signal radiation outside the board.
(3) When possible, minimize the distance between the signal layer and the reference plane.
(4) Pay attention to interlayer interference and avoid parallel wiring of adjacent layers.
(5) When possible, reduce the length of parallel wiring in the same layer, and you can optimize it after wiring.
(6) Pay attention to the signals with fast rising edges, such as Low volume PCB Manufacture and Double Sided PCB Wholesale.

2020年4月24日星期五

What is the Difference Between a PCB And an Integrated Circuit?

PCB (Printed Circuit Board), Chinese name is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. An integrated circuit is a miniature electronic device or component. Adopt a certain process to interconnect transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, make it on a small or several small semiconductor wafers or dielectric substrates, and then package them in a tube case Into a micro-structure with the required circuit function. Let's follow the rigid PCB manufacturer to understand the difference between the two.

The characteristics of China's multilayer PCB boards are: 1. Can be high density: For decades, the high density of printed boards can be developed with the integration of integrated circuits and advances in installation technology. 2. High reliability: Through a series of inspections, tests and aging tests, it can ensure that the PCB can work reliably for a long period of time (usually 20 years). 3. Designability: For the various performance (electrical, physical, chemical, mechanical, etc.) requirements of the PCB, printed board design can be achieved through design standardization, standardization, etc., with short time and high efficiency. 4. Producibility: Adopt modern management, can carry out standardization, scale (quantity), automation and other production, and ensure the consistency of product quality. 5.Testability: Established relatively complete test methods, test standards, various test equipment and instruments to test and identify the qualification and service life of PCB products. Assemblability: PCB products are not only convenient for standardized assembly of various components, but also can be automated and large-scale mass production. At the same time, PCBs and various component assembly components can be assembled to form larger components and systems, up to the entire machine. 6. Maintainability: Since PCB products and various component assembly components are standardized design and large-scale production, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, easily and flexibly, and the system can be quickly resumed. Of course, you can give more examples. For example, the system can be miniaturized and lightened, and the signal transmission speed can be increased.

The characteristics of the integrated circuit are that the integrated circuit has the advantages of small size, light weight, fewer lead wires and solder joints, long life, high reliability, good performance, etc. At the same time, the low cost facilitates mass production. It is not only widely used in industrial and civilian electronic equipment such as radio cassette recorders, televisions, computers, etc., but also widely used in military, communications, remote control and other aspects. The use of integrated circuits to assemble electronic equipment can increase assembly density by several tens to thousands of times over transistors, and the stable working time of the equipment can be greatly improved.

The difference between a PCB board and an integrated circuit is that integrated circuits generally refer to the integration of chips. Like the Northbridge chip on the motherboard, the internal CPU is called an integrated circuit, and the original name is also called an integrated block. The printed circuit refers to the circuit board and the like that we usually see, and there is a solder chip printed on the circuit board.

The integrated circuit (IC) is soldered on the PCB; the PCB version is the carrier of the integrated circuit (IC). The PCB board is a printed circuit board (PCB). Printed circuit boards are found in almost every electronic device. If there are electronic parts in a certain kind of equipment, the printed circuit boards are mounted on PCBs of various sizes. In addition to fixing various small parts, the main function of the printed circuit board is to electrically connect the various parts on it.

To put it simply, integrated circuits are integrated with a common circuit on a chip, which is a whole. Once there is damage inside, the chip is also damaged, and the PCB can solder components by itself, and can be replaced if it is broken.

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