2019年6月30日星期日

High Frequency PCB

Product Details
Layer count: 6
Board thickness: 2mm±0.2mm
Min hole: 0.25mm
Trace/Space: 3.94/3.94mil
Surface Treatment: ENIG
Process: Teflon+FR4 mixed ;Counterbore.
Applications: Communication
TOPFAST is a professional and reliable one-stop PCB solutions provider for customers specialized in manufacturing quick turn prototypes and small volumes. With high quality and on-time delivery products we won the market's wide acclaim. We will continue to focus on customer satisfaction, along with "high quality “and "fast delivery", we will become a PCB service provider worthy of customer trust.
Our products include HDI board, heavy copper board, backplane board, semiconductor test board, high frequency board and rigid-flex board, etc., to meet customers' various demand. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automobile industry, etc.
As a Communication PCB wholesaler, If you want to buy low price 6 layers frequency PCB, Industrial control HDI PCB, pcb buried components, welcome browse our website and contact us.

2019年6月28日星期五

Pcb Industry Has Become The Key To The Development Of The National Economy

Here is High Frequency Pcb Factory talking about PCB industry has become the key to the development of the national economy. 
If you have any idea about Rigid PCB, welcome to contact us and discuss.
Over the past decade, global PCBs have continued to migrate to Asia, especially China, and mainland China has quickly become a major electronics and PCB producer. China's domestic market potential and manufacturing advantages have attracted foreign investment, prompting China's PCB industry to grow in multiples in just a few years.
At present, China's PCB industry has the following four brief features in addition to its output value and sales in the electronic component manufacturing industry:
High Frequency Pcb Factory
1. Product use and market expansion: PCB is a key interconnect of electronic equipment, and any electronic equipment needs to be equipped. Especially in the current electronic information, data processing and communication equipment put higher standards and more requirements on the PCB.
2. Expansion of the industry: The printed circuit industry has evolved from a single board processing to electronic circuit components, including the assembly of electronic circuit components and the development of electronic manufacturing services (EMS). Printed board manufacturers will perform electronic assembly services according to customer requirements.
3. Product grades continue to improve: At present, ordinary PCBs are still suitable for general electronic equipment, and a new generation of electronic equipment requires higher density circuit boards, which is suitable for multi-function, miniaturization and lightweight requirements of the whole machine. Mainly to develop multi-layer boards, flexible boards, and high-density interconnect (HDI/BUM) substrates and IC package (BGA, CSP) substrates.
4. Further improvement of production technology: In order to process high-density circuit boards, new process technologies are needed in graphics production, hole processing, surface coating, and inspection. Blind/buried holes and laminated methods are common applications. The development of new materials for HDI/BUM boards and IC package substrates, and better performance in electrical and mechanical aspects will introduce a large number of new laser and optoelectronic automation equipment.
In 2013, China's PCB production value reached 22.559 billion US dollars, accounting for 41.1% of the global PCB production value.
China's printed circuit board industry also presents a decentralized competitive landscape. The size of enterprises is generally small, and the number of large PCB companies is small. According to CPCA statistics, there were about 1,500 PCB companies in China in 2013, mainly distributed in the Pearl River Delta, the Yangtze River Delta, and the Bohai Rim region. In 2013, a total of 50 large enterprises and super-large enterprises accounted for 3.3% of the total number of PCB companies in mainland China.

2019年6月24日星期一

How To Identify True And False Chips?

Here is Rigid Pcb Manufacturer talking about How To Identify True And False Chips. 
If you have any idea about Buried PCB board, welcome to contact us and discuss.
The complete process of chip fabrication includes chip design, wafer fabrication, package fabrication, and testing. The wafer fabrication process is particularly complicated. China is the world's largest importer of e-waste. Every year, 70% of the world's e-waste is shipped to China. The source of e-waste is mostly developed countries such as Europe, America, and Japan. These e-wastes are expensive to handle in their home countries. After arriving in China, transfer to various places for dismantling.
In Huaqiang North, the largest distribution center for electronic components in Asia, many businesses mainly operate renovation and dismantling parts. The source of these disassembled parts and refurbished parts are the dismantlings of e-waste. The low-cost electronic waste is dismantled, and the available electronic components are refurbished and returned to the component market to earn huge price differences, resulting in the proliferation of counterfeit and refurbished electronic components. 
Rigid Pcb Manufacturer
So, how do we identify true and false chips when we buy?
1. See if the surface of the chip has polished marks
Any surface of the polished chip will have fine lines or even micro marks on the previous print. Some cover the surface of the chip with a thin coating, which looks a bit shiny and has no plastic texture.
2. See the printing
Most of the current chips are laser-marked or printed on a dedicated chip printer. The writing is clear, unobtrusive, unobtrusive and difficult to erase. Refurbished chips are either "saw-toothed" by the edges of the writing tape and are "saw-toothed", or they are illegible, inconsistent, misplaced, easily erasable or too conspicuous.
In addition, the screen printing process of the current IC manufacturers have long been eliminated, but many chip refurbishment due to cost reasons still use the silkscreen process, which is also one of the judgment basis, the screen printing word will be slightly higher than the chip surface, you can feel the slight unevenness by hand touch Or have a feeling of worry.
However, it should be noted that due to the recent sharp decline in the price of small laser marking machines, more and more refurbished ICs use laser marking, and some new films will use this method to change the wordmark or simply replay to "improve" the chip. The grade, this requires special attention, and the method of distinguishing is more difficult, you need to practice the "eyes of fire."
The main method is to look at the overall coordination, the writing and the background, the new and old degree of the pin does not match, such as the word mark is too new, too clear the possibility of problems, but many small factories, especially some small IC companies in China The chip was born like this, which adds a lot of trouble to the identification, but the judgment of the mainstream big chip is still very meaningful.
In addition, more and more laser marking machines have been used to modify chip markings. Especially in memory and some high-end chips, once the location of laser printing is found to be inconsistent in individual letters and strokes, it can be considered false. goods.
3. Look at the pin
All the tin-plated pins that are as bright as “new” must be refurbished. The majority of the pins of the IC should be the so-called “silver powder feet”. The color is darker but the color is uniform. There should be no traces of oxidation or “flux” on the surface. ", DIP and other plug-in pins should not have traces of wiping, even if there is (repackage will be) scratches should be neat, in the same direction and the metal exposed is smooth and non-oxidized.
4. See the device production date and package factory label
The label of the genuine goods, including the label on the bottom surface of the chip, should be consistent and the production time should be consistent with the product. Although the counterfeit chips have the same frontal label, sometimes the values are unreasonable (such as what the "Geely number" is marked) or the production date does not match the device. If the label on the bottom of the device is confusing, the device is a fake.
5. Measure the thickness of the device and look at the edge of the device
Many original laser-printed refurbished refurbished pieces (mostly power devices) must be ground deeper because of the need to remove the original mark, so the overall thickness of the device will be significantly smaller than the normal size, but not compared or measured with a caliper, the general inexperienced person still It's hard to tell, but there is a general knowledge of breaking the law, that is, looking at the front edge of the device. Because the plastic sealing device must be “released” after injection molding, the edge angle of the device is round (R angle), but the size is not large. It is easy to grind the rounded corner at right angle during the grinding process, so the front edge of the device is right angled. Can be judged as grinding goods.
 In addition, there is another method to see if the merchant has a large number of original packaging materials, including the inside and outside of the uniform carton, anti-static plastic bags, etc., the actual identification should be used in multiple ways, there is a problem can be identified The quality of the device.

2019年6月19日星期三

DuPont Sells Soluble OLED Technology and Associated Assets to LG Chem

DuPont Electronics & Imaging confirmed today it has completed the sale of its soluble organic light emitting diode (OLED) technology and associated assets to LG Chem, Ltd.
Assets included in the sale are intellectual property related to DuPont’s soluble OLED technology, and certain equipment for the production of soluble OLED materials and devices. The sale did not include assets or business associated with DowDuPont’s existing evaporative OLED business.
DuPont and LG Chem also have agreed to work together during an extended period of technology transfer to assure a smooth transition and ensure needs are met for ongoing development and customer engagements. Financial details were not disclosed.

About DuPont Electronics & Imaging
DuPont Electronics & Imaging is a global supplier of materials and technologies serving the semiconductor, advanced chip packaging, circuit board, electronic and industrial finishing, photovoltaic, display, and digital and flexographic printing industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies.

About DowDuPont Specialty Products Division
DowDuPont Specialty Products, a division of DowDuPont (NYSE: DWDP), is a global innovation leader with technology-based materials, ingredients and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, building and construction, health and wellness, food and worker safety. DowDuPont intends to separate the Specialty Products Division, which will be called DuPont, into an independent, publicly traded company.

2019年6月14日星期五

IPC Issues Call for Participation for Electronics Materials Forum

IPC−Association Connecting Electronics Industries invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.
The content of the IPC Electronics Materials Forum will focus on materials for board fabrication, assembly, and post-assembly protection with an emphasis on the emerging technologies that challenge our existing materials set. Developments needed for the future will be addressed, and interactive panels will extend an open forum to discuss solutions to these challenges.
IPC is seeking presentations on emerging technologies challenging existing material sets, as well as the following topics of interest:
Substrate Materials:
● Novel board laminates
● Surface finishes
● Solder mask advancements
● Flexible/wearable circuits
● HDI developments

Assembly Materials:
● New solder alloys
● Flux development
● Cleaning chemistries
● Assembly process strategies
● Thermal interface solutions

Protective Materials:
● Cleaning chemistries
● Conformal coatings
● Adhesive
● Underfills
“While many future technologies can be envisioned, they cannot be fully developed without the materials and processes to manufacture them,” said Brook Sandy-Smith, IPC technical education program manager, “this conference is ideal for engineers and managers that procure materials or want to understand advancements in materials for the board, assembly, components, and protective layers.”

About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000-member company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

2019年6月9日星期日

Trackwise Ships 26m-Long Flexible Printed Circuit

Trackwise has shipped a 26-metre long multilayer, flexible printed circuit (FPC), believed to be world’s longest ever produced, for distributing power and control signals across the wings of a solar-powered, unmanned aerial vehicle (UAV). The circuit is one of over fifty supplied by Trackwise into this vehicle.
The entire interconnect system (power and signal) of the vehicle is made of FPCs representing an estimated total systems weight saving of 60% over traditional wire harness. This will enable the UAV, which is being manufactured in the US, to achieve higher payload and/or improved speed and range. The FPCs are manufactured using Improved Harness Technology (IHT), a patented, reel-to-reel manufacturing technique. Conventional FPCs are rarely more than two metres in length, primarily due to limitations of manufacturing processes. IHT overcomes these limitations, enabling FPCs of unlimited length to be produced.
The UAV’s flexible circuit is based on a polyimide substrate. The planar structure of the circuit dissipates heat better than conventional wiring, enabling higher current carrying capacity for a given weight of copper conductor. Printed manufacturing ensures circuit consistency, fewer connection points are needed so reliability is enhanced, and the FPC is easier to install than wire harnesses, reducing a vehicle’s assembly time and cost.
Trackwise CEO, Philip Johnston, said: “There are many new applications emerging for long, lightweight FPCs but aerospace is a natural fit: weight savings, high reliability and cost effectiveness are critical. We’re also seeing growing interest from a variety of sectors including medical and automotive. For the latter, manufacturers are challenged to reduce vehicle weight to improve fuel efficiency at a time when there’s an ever-growing array of electrical and electronic circuits in their vehicles. In particular, electric vehicles are accelerating this trend.”

About Trackwise
Trackwise manufactures to customer specification, specialist products using printed circuit technology.
Its radio frequency (RF) division is primarily focused on the manufacture of printed antennas for communications infrastructure and other high-precision printed circuit products. Here, Trackwise’s materials expertise, particularly in RF and microwave laminates, enables it to optimise the performance of its customers’ products.
The Trackwise flexible printed circuit (FPC) division employs patented Improved Harness Technology™ (IHT) to create flexible, multilayer circuits of unlimited length. IHT overcomes the previous length constraints of conventional FPCs manufacture (typically 610mm) and facilitates the replacement of conventional wire harnesses in a diverse range of applications, particularly in the aerospace and automotive sectors.
FPC benefits over traditional wiring harnesses include substantial reductions in weight, size and installation time. In addition, the consistency, reliability and performance of system interconnect are improved.  Their planar nature also makes them entirely suited to embedding into composites.

2019年6月4日星期二

New TPCA Chairperson Maurice Lee Discusses Opportunities in 5G Era

At his first interview with the TCPA Quarterly after the election, Maurice Lee, the new chairperson of the Taiwan Printed Circuit Association (TCPA) and also PCB Business unit I President of Unimicron Technology Corporation, talked about the challenges in the development of the PCB industry, 5G issues, and the TCPA missions and expectations of his term.
In regards to the outlook of the overall PCB industry in 2019, Chairperson Lee believes that unfavorable factors including the US-China trade war and the increasingly stringent environmental laws of mainland China will be potential threats to Taiwan. In addition, although Taiwan’s PCB industry has a market share of 31.3%, as mainland China is currently the world’s major PCB production cluster, peer competitions should not be overlooked. He suggests that Taiwanese PCB manufacturers should continue to strengthen factory operational management, such as reducing the labor cost with smart automation, quality improvement, and production cost cut, to raise competitiveness.
When asked if 5G is the next business opportunity for the PCB industry, Chairperson Lee replied: “Although 5G devices will be launched one after another in 2019, in lack of infrastructure and applications, it is estimated that 5G application growth will only begin in the communications, computers, and consumer electronics sector in 2020. Also, as it is necessary to overcome the high reliability technology involved with human safety, 5G application in self-driving cars will become more mature after 2020. Therefore, the high-speed and low-lag technology desperately required by 5G application and the stability and thermo solution required by 5G high-frequency signals will be key factors challenging the PCB industrial chain.
In PCB smart manufacture at the moment, Chairperson Lee explained: “The PCB industry is only at the Industry 2.2 stage, and Industry 4.0 is not necessitated by all industries. Take SMEs for example, Industry 3.5 is the best mixed warfare, particularly many PCB factory buildings in Taiwan cannot be demolished for reconstruction, it is necessary to implement smart automation by smartly and effectively exploit resources. After all, instead of being “the best”, the “most appropriate” will sound much better. This idea simply coincides with the value and spirit of Industry 3.5.
Apart from assisting members in making closer exchange and cooperation through TCPA, Lee as the chairperson of TCPA will lead Taiwan’s PCB manufacturers to march toward the next milestone and improve the competitiveness of Taiwan’s PCB industry by exploring the long-term needs of members according to the different aspects specified in the TCPA White Paper.
Business opportunities in relation to 5G begin like flowers in the desert after rain all across the world. TCPA will keep track on 5G related issues. Therefore, TCPA even names the TPCA Show 2019 held at Taipei Nangang Exhibition Center during October 23-25 “5G NEXT” to link the upstream and the downstream of the PCB industry to break the new-generation challenges.