2020年5月24日星期日

Commonly Used Inverter Temperature Detection Circuit

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The temperature detection circuit of common IGBT modules is mostly caused by the internal or external temperature sensor of the module (mostly a negative temperature coefficient thermistor), and a voltage divider circuit of +5V is formed in series with the resistor, thereby converting the temperature change signal into a voltage signal. Directly or after being processed by a voltage follower, it is sent to the MCU pin. The detection signal is an analog voltage signal.
The module temperature detection circuit of the low-power inverter is composed of a temperature sensor and a 555 time-base circuit to form a multi-stable (also called multi-vibrator) circuit. The low-level width of the 3-pin output pulse represents a temperature signal. The temperature detection signal is obtained by D-A conversion of the subsequent stage circuit (MCU).

C37, C38 charging time is determined by R2, D32, the time constant is small, corresponding to the high-level width of the 3-pin output pulse; the discharge time of C37, C38 is determined by the parallel value of RT, R3, the time constant is large, corresponding to 3 The low-level width of the pin output pulse.

Commonly Used Inverter Temperature Detection Circuit

Here is a Rigid Pcb Supplier talking about Commonly used inverter temperature detection circuit.
If you have any idea about Buried PCB Board, welcome to contact us and discuss.
Rigid Pcb Supplier
The temperature detection circuit of common IGBT modules is mostly caused by the internal or external temperature sensor of the module (mostly a negative temperature coefficient thermistor), and a voltage divider circuit of +5V is formed in series with the resistor, thereby converting the temperature change signal into a voltage signal. Directly or after being processed by a voltage follower, it is sent to the MCU pin. The detection signal is an analog voltage signal.
The module temperature detection circuit of the low-power inverter is composed of a temperature sensor and a 555 time-base circuit to form a multi-stable (also called multi-vibrator) circuit. The low-level width of the 3-pin output pulse represents a temperature signal. The temperature detection signal is obtained by D-A conversion of the subsequent stage circuit (MCU).

C37, C38 charging time is determined by R2, D32, the time constant is small, corresponding to the high-level width of the 3-pin output pulse; the discharge time of C37, C38 is determined by the parallel value of RT, R3, the time constant is large, corresponding to 3 The low-level width of the pin output pulse.

2020年5月18日星期一

Commonly Used Inverter Temperature Detection Circuit

Here is Rigid Pcb Manufacturer talking about Commonly used inverter temperature detection circuit. 
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The temperature detection circuit of common IGBT modules is mostly caused by the internal or external temperature sensor of the module (mostly a negative temperature coefficient thermistor), and a voltage divider circuit of +5V is formed in series with the resistor, thereby converting the temperature change signal into a voltage signal. Directly or after being processed by a voltage follower, it is sent to the MCU pin. The detection signal is an analog voltage signal.
Rigid Pcb Manufacturer
The module temperature detection circuit of the low-power inverter is composed of a temperature sensor and a 555 time-base circuit to form a multi-stable (also called multi-vibrator) circuit. The low-level width of the 3-pin output pulse represents a temperature signal. The temperature detection signal is obtained by D-A conversion of the subsequent stage circuit (MCU).

C37, C38 charging time is determined by R2, D32, the time constant is small, corresponding to the high-level width of the 3-pin output pulse; the discharge time of C37, C38 is determined by the parallel value of RT, R3, the time constant is large, corresponding to 3 The low-level width of the pin output pulse.

2020年5月12日星期二

Pcb Industry Has Become The Key To The Development Of The National Economy

Here is High Frequency Pcb Factory talking about PCB industry has become the key to the development of the national economy. 
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Over the past decade, global PCBs have continued to migrate to Asia, especially China, and mainland China has quickly become a major electronics and PCB producer. China's domestic market potential and manufacturing advantages have attracted foreign investment, prompting China's PCB industry to grow in multiples in just a few years.
At present, China's PCB industry has the following four brief features in addition to its output value and sales in the electronic component manufacturing industry:
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1. Product use and market expansion: PCB is a key interconnect of electronic equipment, and any electronic equipment needs to be equipped. Especially in the current electronic information, data processing and communication equipment put higher standards and more requirements on the PCB.
2. Expansion of the industry: The printed circuit industry has evolved from a single board processing to electronic circuit components, including the assembly of electronic circuit components and the development of electronic manufacturing services (EMS). Printed board manufacturers will perform electronic assembly services according to customer requirements.
3. Product grades continue to improve: At present, ordinary PCBs are still suitable for general electronic equipment, and a new generation of electronic equipment requires higher density circuit boards, which is suitable for multi-function, miniaturization and lightweight requirements of the whole machine. Mainly to develop multi-layer boards, flexible boards, and high-density interconnect (HDI/BUM) substrates and IC package (BGA, CSP) substrates.
4. Further improvement of production technology: In order to process high-density circuit boards, new process technologies are needed in graphics production, hole processing, surface coating, and inspection. Blind/buried holes and laminated methods are common applications. The development of new materials for HDI/BUM boards and IC package substrates, and better performance in electrical and mechanical aspects will introduce a large number of new laser and optoelectronic automation equipment.
In 2013, China's PCB production value reached 22.559 billion US dollars, accounting for 41.1% of the global PCB production value.
China's printed circuit board industry also presents a decentralized competitive landscape. The size of enterprises is generally small, and the number of large PCB companies is small. According to CPCA statistics, there were about 1,500 PCB companies in China in 2013, mainly distributed in the Pearl River Delta, the Yangtze River Delta, and the Bohai Rim region. In 2013, a total of 50 large enterprises and super-large enterprises accounted for 3.3% of the total number of PCB companies in mainland China.

2020年5月6日星期三

How To Identify True And False Chips?

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The complete process of chip fabrication includes chip design, wafer fabrication, package fabrication, and testing. The wafer fabrication process is particularly complicated. China is the world's largest importer of e-waste. Every year, 70% of the world's e-waste is shipped to China. The source of e-waste is mostly developed countries such as Europe, America, and Japan. These e-wastes are expensive to handle in their home countries. After arriving in China, transfer to various places for dismantling.
In Huaqiang North, the largest distribution center for electronic components in Asia, many businesses mainly operate renovation and dismantling parts. The source of these disassembled parts and refurbished parts are the dismantlings of e-waste. The low-cost electronic waste is dismantled, and the available electronic components are refurbished and returned to the component market to earn huge price differences, resulting in the proliferation of counterfeit and refurbished electronic components. 
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So, how do we identify true and false chips when we buy?
1. See if the surface of the chip has polished marks
Any surface of the polished chip will have fine lines or even micro marks on the previous print. Some cover the surface of the chip with a thin coating, which looks a bit shiny and has no plastic texture.
2. See the printing
Most of the current chips are laser-marked or printed on a dedicated chip printer. The writing is clear, unobtrusive, unobtrusive and difficult to erase. Refurbished chips are either "saw-toothed" by the edges of the writing tape and are "saw-toothed", or they are illegible, inconsistent, misplaced, easily erasable or too conspicuous.
In addition, the screen printing process of the current IC manufacturers have long been eliminated, but many chip refurbishment due to cost reasons still use the silkscreen process, which is also one of the judgment basis, the screen printing word will be slightly higher than the chip surface, you can feel the slight unevenness by hand touch Or have a feeling of worry.
However, it should be noted that due to the recent sharp decline in the price of small laser marking machines, more and more refurbished ICs use laser marking, and some new films will use this method to change the wordmark or simply replay to "improve" the chip. The grade, this requires special attention, and the method of distinguishing is more difficult, you need to practice the "eyes of fire."
The main method is to look at the overall coordination, the writing and the background, the new and old degree of the pin does not match, such as the word mark is too new, too clear the possibility of problems, but many small factories, especially some small IC companies in China The chip was born like this, which adds a lot of trouble to the identification, but the judgment of the mainstream big chip is still very meaningful.
In addition, more and more laser marking machines have been used to modify chip markings. Especially in memory and some high-end chips, once the location of laser printing is found to be inconsistent in individual letters and strokes, it can be considered false. goods.
3. Look at the pin
All the tin-plated pins that are as bright as “new” must be refurbished. The majority of the pins of the IC should be the so-called “silver powder feet”. The color is darker but the color is uniform. There should be no traces of oxidation or “flux” on the surface. ", DIP and other plug-in pins should not have traces of wiping, even if there is (repackage will be) scratches should be neat, in the same direction and the metal exposed is smooth and non-oxidized.
4. See the device production date and package factory label
The label of the genuine goods, including the label on the bottom surface of the chip, should be consistent and the production time should be consistent with the product. Although the counterfeit chips have the same frontal label, sometimes the values are unreasonable (such as what the "Geely number" is marked) or the production date does not match the device. If the label on the bottom of the device is confusing, the device is a fake.
5. Measure the thickness of the device and look at the edge of the device
Many original laser-printed refurbished refurbished pieces (mostly power devices) must be ground deeper because of the need to remove the original mark, so the overall thickness of the device will be significantly smaller than the normal size, but not compared or measured with a caliper, the general inexperienced person still It's hard to tell, but there is a general knowledge of breaking the law, that is, looking at the front edge of the device. Because the plastic sealing device must be “released” after injection molding, the edge angle of the device is round (R angle), but the size is not large. It is easy to grind the rounded corner at right angle during the grinding process, so the front edge of the device is right angled. Can be judged as grinding goods.
 In addition, there is another method to see if the merchant has a large number of original packaging materials, including the inside and outside of the uniform carton, anti-static plastic bags, etc., the actual identification should be used in multiple ways, there is a problem can be identified The quality of the device.